Materials for the next generation of power electronics: Heraeus presents new bonding ribbon

  • Date 21 Jul 2020

Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.
PowerCuSoft Ribbon is optimized for surface contacting on wide bandgap semiconductors based on silicon carbide (SiC). With this bonding ribbon generation, it is possible to use the full potential of new SiC chips, optimally.

Copper offers better thermal, electrical and mechanical properties compared to aluminum wire and ribbons. The material heats up less than aluminum and can withstand higher module temperatures – this improves the lifespan and reliability of power modules. PowerCuSoft Ribbon can withstand module temperatures of up to 250 °C. In tests, copper ribbons show a ten to twenty times longer service life than comparable products made of aluminum, while at the same time increasing the energy density in the module.

"SiC semiconductors are in the fast lane due to their high power density," says Christian Kersting, Product Manager Power bonding wires at Heraeus Electronics. "In order to be able to use the advantages of these products, module manufacturers need high-performance packaging and interconnection technologies.”

Compared to copper wires, ribbons also offer cost advantages, as one ribbon replaces several copper wires. Manufacturers are thus able to optimize the manufacturing costs per module as output increases. Depending on the module design, even twice the number of modules per hour can be produced.

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