Heraeus to introduce new solutions for advanced packaging and miniLED die attach applications at SEMICON China
- Date 22 Mar 2021
Heraeus Electronics will present two state-of-the-art solder paste products at the SEMICON China on March 17-19. Both products offer solutions in response to the increasing demand from the advanced packaging industry in terms of miniaturization, thermal budget management and cost reduction.
You might also be interested in these articles
Ricardo joins Scottish hydrogen association
Tue 20 Apr 2021
Ricardo UK Ltd
Will Downie named in The Medicine Maker’s Power List for 2021
Tue 20 Apr 2021
Vectura Delivery Devices Ltd
JM announces strategic partnership for sustainable battery materials production and secures critical raw materials supply
Tue 20 Apr 2021
Johnson Matthey